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Series | Grade | Referenced Grades | Applications Example | Microstructure Photo1000X |
Submicron Grades | CU05 | TSM20 | For high wear resistant dies, i.e. for semi-conductor, IC packaging, leadframe |
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CU10 | H10F/TSM30/EF05 | |||
CU25 | F10/TSM40/FB15/EF10 | |||
CU35 | H15F/MG30 | |||
CU50 | EF20/FB20 | |||
Fine Grades | CD08 | KD05 | Stamping tools for Connector, terminal, silicon chips etc., Powder compacting dies, drawing dies. |
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CD10 | NC6/CF/H25S/KD10 | |||
CD20 | CF-H40S/KD20 | |||
CD30 | CD650 | |||
CD40 | KD40 | |||
High toughness Grades(medium) | CG25 | H20S/KG2 | Powder, compacting dies, drawing dies, forging dies. |
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CG35 | H30S/KG3 | |||
CG50 | H40S/KG5 | |||
CG60 | NC8/KG6 | |||
CG70 | H50S | |||
CG80 |
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High Shock Resistant Grades(coarse) | CT40 | B40S |
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CT55 | NC12/ST6 | Galvanized iron, stainless steel screw dies. | ||
CT70 | ST7/EA65/VA70 | Below M20 screw dies/galvanized iron, stainless steel screw dies. | ||
CT80 | NC14/VA80 | Ф20-Ф50 screw dies, six-pc mould | ||
CT90 | NC16/VA90 | Nut mould, Above M20 screw dies | ||
CT95 | EA90/VA95 | High impact mould | ||
Application specific | CM20 | MC20 | Stamping dies used for fine copper & pure iron |
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Grade used for cutters | MH10 | H10F | Cutters |
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MH12 | TSF44,TF25 | Ti-alloy, Ni-alloy cutters |
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