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carbide EDM blanks for stamping dies
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Carbide EDM blanks for stamping dies, for materials ie. IC packaging, leadframe, connector, silicon chip
| Length mm | Tolerance | Width mm | Tolerance | Thickness mm | Tolerance | Flatness mm |
| 100 | 50/100 | 1.0-50.0 | ||||
| 105 | 50/105 | 1.0-50.0 | ||||
| 110 | 50/110 | 1.0-50.0 | ||||
| 115 | 50/115 | 1.0-50.0 | ||||
| 120 | 50/120 | 1.0-50.0 | ||||
| 125 | 50/125 | 1.0-50.0 | ||||
| 130 | 50/130 | 1.0-50.0 | ||||
| 135 | 50/135 | 1.0-50.0 | ||||
| 140 | 50/140 | 1.0-50.0 | ||||
| 145 | 50/145 | 1.0-50.0 | ||||
| 150 | 50/150 | 1.0-50.0 | ||||
| 155 | 50/155 | 1.0-50.0 | ||||
| 160 | 50/160 | 1.0-50.0 | ||||
| 165 | 50/165 | 1.0-50.0 | ||||
| 170 | 50/170 | 1.0-50.0 | ||||
| 175 | 50/175 | 1.0-50.0 | ||||
| 180 | 50/180 | 1.0-50.0 | ||||
| 185 | 50/185 | 1.0-50.0 | ||||
| 190 | 50/190 | 1.0-50.0 | ||||
| 195 | 50/195 | 1.0-50.0 | ||||
| 200 | 50/200 | 1.0-50.0 |
| Grade Chart | |||||
| Code | Grade | Density(g/cm3) | Hardness(HRA) | T.R.S(GPa) | Mpa(m1/2) |
| CU | CU05 | 14.7 | 93.2 | 3.6 | 9.1 |
| CU10 | 14.5 | 92.7 | 3.8 | 9.5 | |
| CU25 | 14.2 | 92 | 3.9 | 10.2 | |
| CU35 | 14 | 91.5 | 3.9 | 10.6 | |
| CU50 | 13.7 | 90.7 | 3.9 | 11.3 | |
| CD | CD08 | 14.6 | 92 | 3.5 | 10 |
| CD10 | 14.5 | 91.5 | 3.6 | 10.4 | |
| CD20 | 14.2 | 90.7 | 3.7 | 11.1 | |
| CD30 | 14 | 90 | 3.8 | 11.9 | |
| CD40 | 13.7 | 89 | 3.8 | 12.7 | |
| CG | CG25 | 14.7 | 91 | 3.4 | 12.8 |
| CG35 | 14.5 | 90.2 | 3.5 | 14.1 | |
| CG50 | 14.3 | 89 | 3.6 | 15.3 | |
| CG60 | 14.1 | 88 | 3.7 | 16.5 | |
| CG70 | 13.9 | 87 | 3.6 | 17.6 | |
| CG80 | 13.6 | 86 | 3.4 | 18.7 | |
| CT | CT40 | 14.2 | 87 | 3.5 | 21 |
| CT55 | 13.9 | 86 | 3.4 | 22.1 | |
| CT70 | 13.6 | 85 | 3.2 | 23.2 | |
| CT80 | 13.4 | 84.5 | 2.9 | 24 | |
| CT90 | 13.2 | 83 | 2.6 | 24.7 | |
| CT95 | 13 | 82 | 2.1 | 25.5 | |
| CM | CM20 | 14.9 | 91 | 3.4 | 15 |
| MH | MH10 | 14.5 | 91.8 | 3.7 | 10.1 |
| MH12 | 14.3 | 92.2 | 3.9 | 12.2 | |
| Grade Recommendation | ||||
| Series | Grade | Referenced Grades | Applications Example | Microstructure Photo1000X |
| Submicron Grades | CU05 | TSM20 | For high wear resistant dies, i.e. for semi-conductor, IC packaging, leadframe |  |
| CU10 | H10F/TSM30/EF05 | |||
| CU25 | F10/TSM40/FB15/EF10 | |||
| CU35 | H15F/MG30 | |||
| CU50 | EF20/FB20 | |||
| Fine Grades | CD08 | KD05 | Stamping tools for Connector, terminal, silicon chips etc., Powder compacting dies, drawing dies. |  |
| CD10 | NC6/CF/H25S/KD10 | |||
| CD20 | CF-H40S/KD20 | |||
| CD30 | CD650 | |||
| CD40 | KD40 | |||
| High toughness Grades(medium) | CG25 | H20S/KG2 | Powder, compacting dies, drawing dies, forging dies. |  |
| CG35 | H30S/KG3 | |||
| CG50 | H40S/KG5 | |||
| CG60 | NC8/KG6 | |||
| CG70 | H50S | |||
| CG80 | ||||
| High Shock Resistant Grades(coarse) | CT40 | B40S |  | |
| CT55 | NC12/ST6 | Galvanized iron, stainless steel screw dies. | ||
| CT70 | ST7/EA65/VA70 | Below M20 screw dies/galvanized iron, stainless steel screw dies. | ||
| CT80 | NC14/VA80 | §¶20-§¶50 screw dies, six-pc mould | ||
| CT90 | NC16/VA90 | Nut mould, Above M20 screw dies | ||
| CT95 | EA90/VA95 | High impact mould | ||
| Application specific | CM20 | MC20 | Stamping dies used for fine copper & pure iron | |
| Grade used for cutters | MH10 | H10F | Cutters | |
| MH12 | TSF44,TF25 | Ti-alloy, Ni-alloy cutters | ||
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